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ISP1103
Universal Serial Bus transceiver
Rev. 01 -- 4 October 1999 Preliminary specification
1. General description
The ISP1103 is a single-chip generic Universal Serial Bus (USB) transceiver that is fully compliant with the Universal Serial Bus Specification Rev. 1.1. It allows 3.3 V USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) to interface with the physical layer of the Universal Serial Bus. It supports transmitting and receiving serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates. It also supports the low-power single-ended input receiver interface in `suspend' mode operation. The ISP1103 operates on a 3.3 V supply voltage. The pin configuration conforms to the `Serial Interface Engine' from the Universal Serial Bus Implementers Forum (USB-IF). The ISP1103 allows for both the `USB-IF Standard Data Interface' and the `Philips Encoded Data Interface'. The ISP1103 is fully pin compatible with the industry-standard Philips Semiconductors USB transceiver PDIUSBP11A.
2. Features
s s s s s s s s s s s s s s Complies with Universal Serial Bus Specification Rev. 1.1 Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates Slew-rate controlled differential data driver Differential input receiver with wide common-mode range and very high data input sensitivity Stable RCV output during SE0 condition Two single-ended receivers with hysteresis Supports `Philips Encoded Data Interface' and `USB-IF Standard Data Interface' Low-power operation in `suspend' mode Operates on a 3.3 V supply voltage Fully backward compatible with PDIUSBP11A Compatible with VHDL `Serial Interface Engine' from USB Implementers Forum Higher than 8 kV ESD protection Full industrial operating temperature range -40 to +85 C Available in SO14, SSOP14 and TSSOP14 packages.
c c
Philips Semiconductors
ISP1103
USB transceiver
3. Ordering information
Table 1: Ordering information Package Name ISP1103D ISP1103DB ISP1103DH SO14 SSOP14 TSSOP14 Description plastic small outline package; 14 leads; body width 3.9 mm plastic shrink small outline package; 14 leads; body width 5.3 mm plastic thin shrink small outline package; 14 leads; body width 4.4 mm Version SOT108-1 SOT337-1 SOT402-1 Type number
4. Functional diagram
handbook, halfpage
n.c. MODE OE SPEED VMO/FSE0 VPO/VO SUSPND RCV
8 1 2 9 13 12 6 3
14
VCC(3.3)
10
D-
11
D+
VP
4
VM
5
7
ISP1103x
MBL094
GND
Fig 1. Functional diagram.
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5. Pinning information
5.1 Pinning
fpage fpage fpage
MODE OE RCV VP VM SUSPND GND
1 2 3 4 5 6 7
MBL091
14 VCC(3.3) 13 VMO/FSE0 12 VPO/VO
MODE OE RCV VP VM SUSPND GND
1 2 3 4 5 6 7
MBL092
14 VCC(3.3) 13 VMO/FSE0 12 VPO/VO
MODE OE RCV VP VM SUSPND GND
1 2 3 4 5 6 7
MBL093
14 VCC(3.3) 13 VMO/FSE0 12 VPO/VO
ISP1103D 11 D+
10 D- 9 SPEED
ISP1103DB 11 D+
10 D- 9 SPEED
ISP1103DH 11 D+
10 D- 9 SPEED
8 n.c.
8 n.c.
8 n.c.
Fig 2. Pinning diagram SO14.
Fig 3. Pinning diagram SSOP14.
Fig 4. Pinning diagram TSSOP14.
5.2 Pin description
Table 2: Symbol MODE Pin description Pin 1 Type I Description driver interface selection input (Schmitt trigger): LOW: Philips Encoded Data Interface (pins VO, FSE0) HIGH: USB-IF Standard Data Interface (pins VPO, VMO); pulled HIGH by an internal pull-up transistor, if left floating OE RCV 2 3 I O output enable input (Schmitt trigger, active LOW); enables the transceiver to transmit data on the bus differential data receiver output (CMOS level); driven HIGH when input SUSPND is HIGH; the output state of RCV is preserved and stable during an SE0 condition single-ended D+ receiver output (CMOS level); used for external detection of single-ended zero (SE0), error conditions, speed of connected device single-ended D- receiver output (CMOS level); used for external detection of single-ended zero (SE0), error conditions, speed of connected device suspend input (Schmitt trigger); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a HIGH level ground supply not connected speed selection input (Schmitt trigger); adjusts the slew rate of differential data outputs D+ and D- according to the transmission speed: LOW: low-speed (1.5 Mbit/s) HIGH: full-speed (12 Mbit/s)
VP
4
O
VM
5
O
SUSPND
6
I
GND n.c. SPEED
7 8 9
I
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Pin description...continued Pin 10 11 12 13 14 Type AI/O AI/O I I Description negative USB data bus connection (analog, differential); for low-speed mode connect to pin VCC(3.3) via a 1.5 k resistor positive USB data bus connection (analog, differential); for full-speed mode connect to pin VCC(3.3) via a 1.5 k resistor differential driver data input (Schmitt trigger); see Table 4 differential driver data input (Schmitt trigger); see Table 4 supply voltage (3.0 to 3.6 V)
Table 2: Symbol D- D+ VPO/VO
VMO/FSE0 VCC(3.3)
6. Functional description
6.1 Function selection
Table 3: SUSPND L L H H
[1] [2]
Function table OE L H L H D+/D- driving receiving [1] driving high-Z [1] RCV active active inactive [2] inactive [2] VP/VM active active active active Function normal driving (differential receiver active) receiving driving during `suspend' (differential receiver inactive) low-power state
Signal levels on D+/D- are determined by other USB devices and external pull-up/down resistors. In `suspend' mode (SUSPND = H) the differential receiver is inactive and output RCV is always HIGH. Out-of-suspend (`K') signalling is detected via the single-ended receivers VP and VM.
6.2 Operating functions
Table 4: MODE Driving function (OE = L) Interface type VPO/VO L L Philips Encoded Data Interface L H H L H USB-IF Standard Data Interface L H H Table 5: Receiving function (OE = H) D+/D- differential logic 0 differential logic 1 SE0
[1]
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VMO/FSE0 L H L H L H L H
Data differential logic 0 SE0 differential logic 1 SE0 SE0 differential logic 0 differential logic 1 illegal data
RCV L H RCV*
VP L H L
VM H L L
RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is kept stable during the SE0 period.
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USB transceiver
7. Limiting values
Table 6: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC(3.3) VI Ilatchup Vesd Tstg Ptot
[1]
Parameter supply voltage input voltage latchup current electrostatic discharge voltage storage temperature total power dissipation
Conditions
Min -0.5 -0.5
Max +6.0 VCC + 0.5 200 8000 +150
Unit V V mA V C W
VI < 0 or VI > VCC ILI < 1 A
[1]
-60 -
Equivalent to discharging a 100 pF capacitor via a 1.5 k resistor (Human Body Model).
Table 7: Symbol VCC(3.3) VI VI(AI/O) Tamb
Recommended operating conditions Parameter supply voltage input voltage input voltage on analog I/O pins (D+/D-) operating ambient temperature Conditions Min 3.0 0 0 -40 Max 3.6 5.5 3.6 +85 Unit V V V C
8. Static characteristics
Table 8: Static characteristics: supply pins VCC = VCC(3.3); VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol ICC ICC(susp) Parameter operating supply current suspend supply current Conditions Min Typ Max 10 Unit mA A
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Table 9: Static characteristics: digital pins VCC = VCC(3.3); VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Vth(LH) Vth(HL) Vhys Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 3 mA IOL = 20 A IOL = 3 mA IOL = 20 A Leakage current ILI input leakage current 1 A 2.4 VCC(3.3) - 0.1 0.4 0.1 V V V V Parameter positive-going threshold voltage negative-going threshold voltage hysteresis voltage Conditions Min 1.4 0.9 0.4 Typ Max 1.9 1.5 0.7 Unit V V V Schmitt trigger input levels
Table 10: Static characteristics: analog I/O pins (D+, D-) [1] VCC = VCC(3.3); VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Input levels VDI VCM VIL VIH Vhys Output levels VOL VOH ILZ Capacitance CIN Resistance ZDRV ZINP Termination VTERM termination voltage [3] for upstream port pull-up (RPU) 3.0 [4] 3.6 V driver output impedance [2] input impedance steady-state drive 28 10 44 M transceiver capacitance pin to GND 20 pF LOW-level output voltage HIGH-level output voltage OFF-state leakage current RL = 1.5 k to VCC(3.3) RL = 15 k to GND 2.8 0.3 VCC(3.3) 10 V V A differential input sensitivity differential common mode voltage LOW-level input voltage HIGH-level input voltage hysteresis voltage |VI(D+) - VI(D-)| includes VDI range 0.2 0.8 2.0 0.4 2.5 0.8 0.7 V V V V V Parameter Conditions Min Typ Max Unit
Leakage current
[1] [2] [3] [4]
D+ is the USB positive data pin; D- is the USB negative data pin. Includes external resistors of 22 1% or 24 1% on both D+ and D-. This voltage is available at pin VCC(3.3). In `suspend' mode the minimum voltage is 2.9 V.
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9. Dynamic characteristics
Table 11: Dynamic characteristics: analog I/O pins (D+, D-); full-speed mode [1] VCC = VCC(3.3); VGND = 0 V; Tamb = -40 to +85 C; CL = 50 pF; RPU = 1.5 k on D+ to VTERM.; unless otherwise specified. Symbol tFR Parameter rise time Conditions CL = 50 pF; 10 to 90% of |VOH - VOL|; see Figure 5 CL = 50 pF; 90 to 10% of |VOH - VOL|; see Figure 5
[2]
Min 4
Typ -
Max 20
Unit ns
Driver characteristics
tFF
fall time
4
-
20
ns
FRFM VCRS Driver timing tPLH tPHL tPHZ tPLZ tPZH tPZL
differential rise/fall time matching (tFR/tFF) output signal crossover voltage propagation delay (VPO,VMO/FSE0 to D+,D-) 3-state output disable time (OE to D+,D-) 3-state output enable time (OE to D+,D-)
90 1.3 -
-
111.1 2.0 14 14 6 5 14 15
% V ns ns ns ns ns ns
[2] [3]
LOW-to-HIGH; see Figure 8 HIGH-to-OFF; see Figure 6 LOW-to-OFF; see Figure 6 OFF-to-HIGH; see Figure 6 OFF-to-LOW; see Figure 6
HIGH-to-LOW; see Figure 8 -
Receiver timing Differential receiver tPLH tPHL tPLH tPHL
[1] [2] [3]
propagation delay (D+,D- to RCV)
LOW-to-HIGH; see Figure 7
-
-
8 8 5 8
ns ns ns ns
HIGH-to-LOW; see Figure 7 LOW-to-HIGH; see Figure 7 -
Single-ended receiver propagation delay (D+,D- to VP,VM) HIGH-to-LOW; see Figure 7 -
Test circuit: see Figure 11. Excluding the first transition from Idle state. Characterized only, not tested. Limits guaranteed by design.
Table 12: Dynamic characteristics: analog I/O pins (D+, D-); low-speed mode [1] VCC = VCC(3.3); VGND = 0 V; Tamb = -40 to +85 C; CL = 50 pF; RPU = 1.5 k on D- to VTERM.; unless otherwise specified. Symbol tLR Parameter rise time Conditions CL = 200 to 600 pF; 10 to 90% of |VOH - VOL|; see Figure 5 CL = 200 to 600 pF; 90 to 10% of |VOH - VOL|; see Figure 5
[2]
Min 75
Typ -
Max 300
Unit ns
Driver characteristics
tLF
fall time
75
-
300
ns
LRFM VCRS
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differential rise/fall time matching (tLR/tLF) output signal crossover voltage
85 1.3
-
118 2.0
% V
[2] [3]
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Rev. 01 -- 4 October 1999
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Table 12: Dynamic characteristics: analog I/O pins (D+, D-); low-speed mode [1]...continued VCC = VCC(3.3); VGND = 0 V; Tamb = -40 to +85 C; CL = 50 pF; RPU = 1.5 k on D- to VTERM.; unless otherwise specified. Symbol Driver timing tPLH tPHL tPHZ tPLZ tPZH tPZL propagation delay (VPO/VO, VMO/FSE0 to D+,D-) 3-state output disable time (OE to D+,D-) 3-state output enable time (OE to D+,D-) LOW-to-HIGH; see Figure 8 HIGH-to-OFF; see Figure 6 LOW-to-OFF; see Figure 6 OFF-to-HIGH; see Figure 6 OFF-to-LOW; see Figure 6 165 145 6 5 100 100 ns ns ns ns ns ns HIGH-to-LOW; see Figure 8 Parameter Conditions Min Typ Max Unit
Receiver timing Differential receiver tPLH tPHL tPLH tPHL
[1] [2] [3]
propagation delay (D+,D- to RCV)
LOW-to-HIGH; see Figure 7
-
-
9 10 5 8
ns ns ns ns
HIGH-to-LOW; see Figure 7 LOW-to-HIGH; see Figure 7 -
Single-ended receiver propagation delay (D+,D- to VP,VM) HIGH-to-LOW; see Figure 7 -
Test circuit: see Figure 11. Excluding the first transition from Idle state. Characterized only, not tested. Limits guaranteed by design.
+3.0 to +5.5 V logic input 0V t FR, t LR VOH t FF, t LF +3.3 V differential data lines
MGS255
1/2VCC(3.3)
t PZH t PZL
t PHZ t PLZ VOH - 0.3 V
90% 10%
90% 10%
VCRS VOL + 0.3 V
MGS257
VOL
0V
Fig 5. Rise and fall times.
+3.3 V differential data lines 0V t PLH VOH logic output 0V 1/2VCC(3.3)
MGS256
Fig 6.
Timing of OE to D+, D-.
+3.0 to +5.5 V VCRS logic input 0V t PHL +3.3 V differential data lines 0V VCRS
MGS254
1/2VCC(3.3)
t PLH
t PHL
Fig 7. Timing of D+, D- to RCV, VP, VM.
Fig 8. Timing of VPO/VO, VMO/FSE0 to D+, D-.
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10. Test information
handbook, halfpage
test point 22 or 24 D.U.T. 50 pF V
MGS258
500
V = 0 V for tPZH, tPHZ V = VCC(3.3) for tPZL, tPLZ
Fig 9. Load for enable and disable times.
handbook, halfpage
test point
D.U.T. 25 pF
MGS259
Fig 10. Load for VM, VP and RCV.
handbook, halfpage
test point 22 or 24 S1
VCC(3.3) RPU 1.5 k
D.U.T. 15 k CL test S1
D-/LS closed D+/LS open D-/FS open D+/FS closed
MGS260
Load capacitance: CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing) CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing). Speed selection: full-speed mode (FS): 1.5 k pull-up resistor on D+ low-speed mode (LS): 1.5 k pull-up resistor on D-.
Fig 11. Load for D+, D-.
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11. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 inches 0.069 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.050 0.041 0.228 0.016
0.028 0.004 0.012
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06S JEDEC MS-012AB EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
Fig 12. SO14 package outline.
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SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
D
E
A X
c y HE vM A
Z 14 8
Q A2 pin 1 index Lp L 1 bp 7 wM detail X A1 (A 3) A
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.4 0.9 8 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT337-1 REFERENCES IEC JEDEC MO-150AB EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 96-01-18
Fig 13. SSOP14 package outline.
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Preliminary specification
Rev. 01 -- 4 October 1999
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TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c y HE vMA
Z
14
8
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 94-07-12 95-04-04
Fig 14. TSSOP14 package outline.
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12. Soldering
12.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.
12.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C.
12.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle
to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
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Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
12.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
12.5 Package related soldering information
Table 13: Suitability of surface mount IC packages for wave and reflow soldering methods Package BGA, LFBGA, SQFP, TFBGA HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC [3], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO
[1]
Soldering method Wave not suitable not suitable [2] Reflow [1] suitable suitable suitable suitable suitable
suitable not not recommended [3] [4] recommended [5]
[2]
[3] [4] [5]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
13. Revision history
Table 14: Revision history Rev Date 01 19991004 CPCN Description Preliminary specification; initial version.
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14. Data sheet status
Datasheet status Objective specification Preliminary specification Product status Development Qualification Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Product specification
Production
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
15. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
16. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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USB transceiver
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA68)
9397 750 06329
(c) Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 -- 4 October 1999
16 of 17
Philips Semiconductors
ISP1103
USB transceiver
Contents
1 2 3 4 5 5.1 5.2 6 6.1 6.2 7 8 9 10 11 12 12.1 12.2 12.3 12.4 12.5 13 14 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function selection. . . . . . . . . . . . . . . . . . . . . . . 4 Operating functions. . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 Package related soldering information . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
(c) Philips Electronics N.V. 1999.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 4 October 1999 Document order number: 9397 750 06329

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